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Design Considerations for Using the FS2229 AGP3.0 (8X) Analysis Probe The FS2229 attaches to the customer target system using the FS1010 flexible adapter, which is soldered onto the bottom of the motherboard on the AGP connector pins sticking through the motherboard. Because motherboard thickness varies, some customers may want to choose an AGP connector with a longer pin for their target systems to insure that sufficient material is available to solder to the FS1010. The AMP 124 pin connector 145263 is available in 3 pin lengths: -1 (0.80"), -2 (.100"), and -3 (.125"). The flexible adapter is about .020" thick so we recommend about a .030" pin protrusion on the backside of the board for good soldering. It would be possible to do it with less, but you risk having to put more heat into the flexible adapter to get the solder to reflow and that increases your risk of damaging the etches on the flexible adapter. As many targets are .062 to .095 thick, we recommend that you use the -3 from AMP or an equivalent. If you are using the AGP PRO 172-pin connector 145410, it also comes in the same pin lengths listed above. For the reasons listed above we recommend you use the -3 from AMP or an equivalent. We recommend that you maintain a component keep-out zone of approximately .350" off the centerline of the AGP connector's B odd row (outermost). This zone will work for most small discrete devices. A target would need more space if there was a tall device nearby. References:
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Copyright 2006 FuturePlus Systems Corporation |
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